There has been some exciting developments for anyone who has been keeping an eye on the upcoming Oppo Find X smartphone which is due out soon from the Chinese makers.
Oppo is now making a name for themselves as a genuine alternative to other Chinese brands such as Xiaomi and Huawei – with the Oppo Find X the next flagship to release this year.
Now it looks like the specs have leaked out ahead of a reveal which will take place in Paris on June 19.
If we are to believe the spec sheet posted by Onleaks, then the device is going to be packing some rather desirable hardware features.
— /LEAKS (@Slashleaks) June 13, 2018
They will include the latest Snapdragon 845 processor, a whopping 8GB of RAM, 128GB or 256GB of internal storage, a 20MP + 16MP rear camera and wait for it – a 25MP camera on the front for superior selfie image quality.
3D gaming could also be very suited to the Oppo Find X as the sheet mentions an Adreno 630 graphics chip, which offers a 30% increase to speed and performance compared to the previous generation chip.
Consider us very impressed if the Oppo Find X is shipping with these specs on board. As we wait for the official reveal, let us know if you are starting to believe that a Chinese branded phone is the way to go for you.