Oki’s Through-Hole Technology Creates Smaller Mobile Phone Cameras

A new manufacturing technique has been developed by Oki which claims to make it possible to make camera modules for mobile phones smaller still! The company has started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors by using through-hole technology. This process can halve the size of conventional camera modules.

To make a camera module smaller, the image sensor needs to be miniaturized. The new W-CSP technology by Oki creates a through-hole in the silicon substrate such as an image sensor and putting an electrode through the newly made hole.

Takaki Yamada, President of the Silicon Microdevice Company at Oki has said,

“OKI is currently one of the industry’s largest-scale manufacturers of W-CSP technology, packaging LSIs of a size equivalent to the semiconductor chip itself. Based on the through-hole W-CSP technology, manufacturers can make smaller camera modules, responding to trends such as the steadily shrinking size of mobile equipment.

“We plan to increase the production level to 10,000 wafers per month within the fiscal year ending March 2009 and are considering increasing up to 20,000 wafers per month by the fiscal year ending March 2010, taking the expected demand increase into consideration.”

Do our camera phones really need to be made smaller?

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